Manufacturing Facilities

Microtech Designs offers full supply chain management, assembly, final test, and shipping to our clients’ facility. Through outsourcing of electronics circuit assembly we are able to bring about significant cost savings to our clients.

TECHNICAL CAPABILITIES

  • Surface mount & through-hole assembly
  • Finepitch BGA assembly with X-ray inspection
  • RF testing facilities
  • Customised test jigs
  • In-circuit-test (ICT), functional testing, temperature controlled burn-in test and automatic optical inspection (AOI) services.
  • IC programming, product serialising and labeling services
  • Handling of all logistics requirements

Is there an interesting project on your mind?

Get in touch with us today, and we'll make it a reality tomorrow